Capabilities and Equipment

Surface Mount Technology | Thru-hole Assembly | Testing | Inspection

Thru-hole Assembly

  • Separate stuffing and final assembly lines
  • Semi-automated prep equipment
  • Prep to customer specification/product requirements
  • Manncorp- Wave Solder Dual pot (Lead/free or Tin/Lead)
    wave-soldering machines with both LAMBDA and CHIP waves available.
  • High-Temp (tin/silver) wave soldering
  • Fluxing systems use aqueous flux
  • Technical Devices- In line aqueous PWA cleaning machines with deionized water rinse and air knife drying.
  • Large Sub Assembly area for building wire and cable assemblies.