Capabilities and Equipment
- Separate stuffing and final assembly lines
- Semi-automated prep equipment
- Prep to customer specification/product requirements
- Manncorp- Wave Solder Dual pot (Lead/free or Tin/Lead)
wave-soldering machines with both LAMBDA and CHIP waves available.
- High-Temp (tin/silver) wave soldering
- Fluxing systems use aqueous flux
- Technical Devices- In line aqueous PWA cleaning machines with deionized water rinse and air knife drying.
- Large Sub Assembly area for building wire and cable assemblies.